Milan, Italy-based company focused on packaging directly in warehouses
Voidless has raised €2.2M across 1 funding round from 2 investors, most recently a Seed round in Feb 2024. Based in Milan, Italy; active in Hardware. Data as of 7 Aug 2026.
Timing: overdue vs cohort gap · momentum unknown. Funding-only estimates, not predictions and not investment advice — see signals.
| Date | Stage | Amount | Investors | |
|---|---|---|---|---|
| 2024-02-06 | Seed | €2.2M |
| 360 Capital,CDP Venture Capital |
| View deal → |
