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Kandou

High-speed, energy-efficient, chip link solutions company.

Kandou has raised €470M across 6 funding rounds from 7 investors, most recently a Series A round in Mar 2026. Based in Lausanne, Switzerland; founded 2011; active in Semiconductors. Data as of 28 Oct 2026.

Lausanne, SwitzerlandFounded 2011www.kandou.com ↗
Semiconductors
← All companies
Total raised
€470M
€470,038,521
Funding rounds
6
Investors
7
distinct backers
Active since
2016-07
latest 2026-03

Funding by year

EUR raised per year · 2026 YTD
Kandou — funding by year — interactive chart.
Data table
Kandou — funding by year
2016€14M
2019€51M
2020€78M
2021€66M
2023€67M
2026€194M

Signals

High confidence
Raise-next likelihood42
base rate 44% for Series A
  • ▼ Raised very recently
  • ▲ Up-round momentum
  • ▼ Low backer re-investment
Exit likelihood28
base rate 11% (2+ rounds)
  • ▲ €100M+ raised
  • ▲ 6 rounds raised
  • ▲ Recently backed by strong-exit-track investors

Timing: too soon vs cohort gap · momentum up. Funding-only estimates, not predictions and not investment advice — see signals.

Funding rounds

6 rounds
DateStageAmountInvestors
2026-03-23Series A€194MAlchip Technologies Limited,Cadence Design Systems,Maverick Silicon,SoftBank Group Corp.,SynopsysView deal →
2023-09-14Series D+€67M—View deal →
2021-12-17Series D+€66MDC Investment Partners,Bessemer Venture PartnersView deal →
2020-11-18Other€78M—View deal →
2019-10-01Series C€51MBessemer Venture PartnersView deal →
2016-07-01Growth/Late€14MBessemer Venture PartnersView deal →

Investors

7
Alchip Technologies LimitedBessemer Venture PartnersCadence Design SystemsDC Investment PartnersMaverick SiliconSoftBank Group Corp.Synopsys

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