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Kandou

High-speed, energy-efficient, chip link solutions company.

Lausanne, SwitzerlandFounded 2011www.kandou.com
Total raised
€467M
€467,409,879
Funding rounds
6
Investors
7
distinct backers
Active since
2016-06
latest 2026-03

Funding by year

EUR raised per year · 2026 YTD

Signals

High confidence
Raise-next likelihood32
base rate 44% for Series A
  • Raised very recently
  • Up-round momentum
  • Low backer re-investment
Exit likelihood28
base rate 12% (2+ rounds)
  • 6 rounds raised
  • €100M+ raised
  • 15y since founding

Timing: too soon vs cohort gap · momentum up. Funding-only estimates, not predictions and not investment advice — see signals.

Funding rounds

6 rounds
DateStageAmountInvestors
2026-03-23Series A€194MAlchip Technologies Limited,Cadence Design Systems,Maverick Silicon,SoftBank Group Corp.,SynopsysView deal →
2023-09-14Series D+€67MView deal →
2021-12-17Series D+€66M DC Investment Partners,Bessemer Venture PartnersView deal →
2020-11-18Other€78MView deal →
2019-10-01Series C€48MBessemer Venture PartnersView deal →
2016-07-01Growth/Late€14MBessemer Venture PartnersView deal →

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