High-speed, energy-efficient, chip link solutions company.
Kandou has raised €470M across 6 funding rounds from 7 investors, most recently a Series A round in Mar 2026. Based in Lausanne, Switzerland; founded 2011; active in Semiconductors. Data as of 7 Aug 2026.
Timing: too soon vs cohort gap · momentum up. Funding-only estimates, not predictions and not investment advice — see signals.
| Date | Stage | Amount | Investors |
|---|
| 2026-03-23 | Series A | €194M | Alchip Technologies Limited,Cadence Design Systems,Maverick Silicon,SoftBank Group Corp.,Synopsys | View deal → |
| 2023-09-14 | Series D+ | €67M | — | View deal → |
| 2021-12-17 | Series D+ | €66M | DC Investment Partners,Bessemer Venture Partners | View deal → |
| 2020-11-18 | Other | €78M | — | View deal → |
| 2019-10-01 | Series C | €51M | Bessemer Venture Partners | View deal → |
| 2016-07-01 | Growth/Late | €14M | Bessemer Venture Partners | View deal → |
