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Tech.euFundingExplorerBeta

Egide

semiconductor packaging for telecoms chips

Total raised
€11M
€10,650,000
Funding rounds
3
Investors
6
distinct backers
Active since
2023-08
latest 2026-03

Funding by year

EUR raised per year · 2026 YTD

Signals

High confidence
Raise-next likelihood31
base rate 44% for Seed
  • Raised very recently
  • Up-round momentum
  • Low backer re-investment
Exit likelihood14
base rate 12% (2+ rounds)
  • 3 rounds raised

Timing: too soon vs cohort gap · momentum up. Funding-only estimates, not predictions and not investment advice — see signals.

Funding rounds

3 rounds
DateStageAmountInvestors
2026-03-23Seed€8.0MEurazeo,Expeditions Fund,Galion.exe,Heartcore Capital,Kima VenturesView deal →
2023-08-15Other€1.9MCompagnie Nationale de NavigationView deal →
2023-08-15Debt€750kView deal →

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